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INTEGRATED CIRCUITS
DATA SHEET
TDA6120Q Video output amplifier
Product specification Supersedes data of 2000 Apr 19 File under Integrated Circuits, IC02 2000 Dec 13
Philips Semiconductors
Product specification
Video output amplifier
FEATURES * High large-signal bandwidth of 32 MHz (typ.) at 125 V (p-p) * High small-signal bandwidth of 47 MHz (typ.) at 60 V (p-p) * Rise/fall time of 12.5 ns for 125 V (p-p) * High slew rate of 10 V/ns * Low static power dissipation of 2.6 W at 200 V supply voltage * High maximum output voltage * Bandwidth independent of voltage gain ORDERING INFORMATION TYPE NUMBER TDA6120Q PACKAGE NAME DBS13P DESCRIPTION plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm) GENERAL DESCRIPTION
TDA6120Q
* Maximum overall voltage gain over 46 dB * High Power Supply Rejection Ratio (PSRR) * Fast cathode current measurement output for dark current control loop * Differential voltage input.
The TDA6120Q is a single 32 MHz, 125 V (p-p) video output amplifier contained in a plastic DIL-bent-SIL power package. The device uses high-voltage DMOS technology and is intended to drive the cathodes of a CRT in High Definition TVs (HDTVs) or monitors.
VERSION SOT141-8
2000 Dec 13
2
Philips Semiconductors
Product specification
Video output amplifier
BLOCK DIAGRAM
handbook, full pagewidth
TDA6120Q
IIN 5 n.c. 9, 11
VDD 10 MIRROR 4x out CASCODE 12 13
TDA6120Q
6 0.7 pF MIRROR in 1x out
in
1x VCC 1x
OUTC OUT
out 1x out 4x in CURRENT INPUT + CASCODE J 5 mA
7
OUTM
VIN-
2
1 RC-
3 RC+
4 VIN+
8
MGK440
GND
Fig.1 Block diagram.
handbook, full pagewidth
Vref
+12 V
+200 V
Cr 10 nF
CCC 47 F
CC CD 100 100 nF nF
CDD 10 F
Dflash
50 VIN- 2 4 VIN+ 6 VCC 8 GND VDD 10 OUTC 12
TDA6120Q
1 RC- Ri 442 VIN C1 68 pF 3 RC+ 5 IIN 7 OUTM 9 n.c. 11 n.c. 13 OUT
Ria 22
Rf 22 k
Rflash 220 CRT
MGK441
Fig.2 Top view.
2000 Dec 13
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Philips Semiconductors
Product specification
Video output amplifier
PINNING SYMBOL RC- VIN- RC+ VIN+ IIN VCC OUTM GND n.c. VDD n.c. OUTC OUT PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 DESCRIPTION inverting input pre-emphasis network inverting voltage input non-inverting input pre-emphasis network non-inverting voltage input feedback current input low supply voltage (12 V) cathode current measurement output power ground not connected high supply voltage (200 V) not connected cathode output feedback output
handbook, halfpage
TDA6120Q
RC- 1 VIN- 2 RC+ 3 VIN+ 4 IIN 5 VCC 6 OUTM 7
TDA6120Q
GND 8 n.c. 9 VDD 10 n.c. 11 OUTC 12 OUT 13
MGK438
Fig.3 Pin configuration.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VDD VCC Vi Vi(dif) Vi(pe) Vi(dif)(pe) VIIN VOUTM Vo Tstg Tj VESD high supply voltage low supply voltage input voltage (pins 2 and 4) differential mode input voltage (pins 2 and 4) pre-emphasis input voltage (pins 1 and 3) differential mode pre-emphasis input voltage (pins 1 and 3) input voltage (pin 5) measurement output voltage output voltage (pins 12 and 13) storage temperature junction temperature voltage peak human body model voltage peak machine model PARAMETER 0 0 0 -VCC 0 -VCC 0 0 0 -55 -20 - - MIN. MAX. 280 20 VCC +VCC VCC +VCC 2VBE 20 VDD +150 +150 2000 300 V V V V V V V V V C C V V UNIT
2000 Dec 13
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Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
handbook, halfpage
20
MGK442
Ptot (W)
16
12
(1)
8
4
(2)
0 -20
0
20
40
80
120 160 Tamb (C)
(1) Infinite heatsink. (2) No heatsink.
Fig.4 Power derating curve.
THERMAL CHARACTERISTICS SYMBOL Rth(j-c) PARAMETER thermal resistance from junction to case VALUE 3.0 UNIT K/W
QUALITY SPECIFICATION Quality specification in accordance with "SNW-FQ-611 part D".
2000 Dec 13
5
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
CHARACTERISTICS Operating range: Tj = -20 to +150 C; VDD = 180 to 210 V; VCC = 10.8 to 13.2 V; VOUTM = 3 to 16.5 V; VVIN- = 1.5 to VCC - 6 V; VVIN+ = 1.5 to VCC - 6 V. Test conditions: Tj = 25 C; VDD = 200 V; VCC = 12 V; VVIN+ = 3 V; VOUTM = 6 V; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 4 K/W; test circuit of Fig.5; unless otherwise specified. SYMBOL IDD(q) ICC(q) Ibias VOUTC VOUTC(T) PARAMETER quiescent high voltage supply current CONDITIONS VOUTC = 100 V 9 35 - 85 -100 MIN. 11 45 76 103 -25 TYP. MAX. 13 55 - 120 +55 UNIT mA mA A V mV/K
quiescent low voltage supply VVIN- = VVIN+ current input bias current (pins 2 and 4) DC output voltage (pins 12 and 13) DC output voltage temperature drift (pins 12 and 13) offset current of measurement output linearity of current transfer input capacitance (pins 2 and 4) maximum dynamic peak output current (pin 12) minimum output voltage (pin 12) maximum output voltage (pin 12) VCC switch level at which pins OUT and OUTC become HIGH internal gain small-signal bandwidth (pin 12) large-signal bandwidth (pin 12) cathode output propagation time 50% input to 50% output (pin 12) VOUTC(AC) = 60 V (p-p); VOUTC(DC) = 100 V VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Figs 6 and 7 VOUTC = 100 V VVIN- = VVIN+ VVIN- = VVIN+; temperature range 30 C < Tj < 110 C note 1 -50 A < IOUTC < +50 A; note 1 VOUTC = VOUTC(max) 20 V < VOUTC < VDD - 20 V
I(offset)OUTM IOUTM/IOUTC Ci IOUTC(max) VOUTC(min) VOUTC(max) VCC(sw)
-30 - - - - VDD - 10 -
0 1.0 4 100 4 VDD - 6 8.8
+30 - - - 10 - -
A
pF mA V V V
Gint Bs Bl tpd
1.68 40 28 10
1.87 47 32 -
2.08 - - 15 MHz MHz ns
2000 Dec 13
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Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
SYMBOL to(r)
PARAMETER cathode output rise time 10% output to 90% output (pin 12)
CONDITIONS VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Fig.6 10
MIN.
TYP. 12.5
MAX. 18
UNIT ns
to(f)
cathode output fall time 90% VOUTC(AC) = 125 V (p-p); output to 10% output VOUTC(DC) = 100 V; square wave; f < 1 MHz; (pin 12) tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Fig.7 settling time 50% input to (99% < output < 101%) (pin 12) VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Figs 6 and 7
10
12.5
15
ns
tst
-
-
350
ns
SRr
slew rate rise between VVIN- = 2 V (p-p); square 30 V to (VDD - 30 V) (pin 12) wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns VVIN- = 2 V (p-p); square slew rate fall between (VDD - 30 V) to 30 V (pin 12) wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns cathode output voltage overshoot rise (pin 12) VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Figs 6 and 7 VOUTC(AC) = 125 V (p-p); VOUTC(DC) = 100 V; square wave; f < 1 MHz; tf(VIN-) = 10 ns; tr(VIN-) = 10 ns; see Figs 6 and 7 f < 50 kHz; note 2 f < 50 kHz; note 2
-
8
-
V/ns
SRf
-
10
-
V/ns
OVr
-
5
-
%
OVf
cathode output voltage overshoot fall (pin 12)
-
20
-
%
PSRRh PSRRl Notes
high voltage power supply rejection ratio low voltage power supply rejection ratio
- -
44 48
- -
dB dB
1. The operating range of the measurement output OUTM is 3 to 16.5 V. Below 3 V, OUTM acts as a voltage source with an output resistance such that the maximum current input from OUTM is 1.25 mA. 2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.
2000 Dec 13
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Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
handbook, full pagewidth
+12 V
RCC 47 CCCC 47 F CCC 10 nF CDD 10 nF CDDD 10 F
RDD 47
+200 V
C10 VIN Ra 50 C11
22 nF 10 F VIN- 2 1 C1 68 pF Ri 442 RC+ VIN+ 3 4 8 GND VCC 6
Rf
Rba 1 k
RC-
22 k VDD 10 IIN 5 OUT 13 12 7 OUTM C7 Im 3.3 pF C9 136 pF
MGK443
Vref Rbb 1 k C12 C13 22 nF 10 F
TDA6120Q
OUTC
Rflash 147 C8 6.8 pF R3 2 M VOUT R2 100 k
Ria 22
Rf Overall gain = G int x ----Ri
Fig.5 Test circuit with gain of 40 dB.
2000 Dec 13
8
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
x Vi
0 t
x tst overshoot (in %) 162.5 150 Voc 100 161.25 163.75
50 37.5
t to(r) tpd
MGK444
Fig.6 Output (pins 12 and 13; rising edge) as a function of input signal.
2000 Dec 13
9
Philips Semiconductors
Product specification
Video output amplifier
TDA6120Q
x Vi
0 t
x tst
162.5 150 Voc 100 overshoot (in %) 50 37.5 38.75 36.25 t to(r) tpd
MGK445
Fig.7 Output (pins 12 and 13; falling edge) as a function of input signal.
FLASHOVER PROTECTION The TDA6120Q needs an external protection diode combined with a 50 resistor to protect the video amplifier against CRT flashover discharge. An external 147 carbon high-voltage resistor in combination with a 2 kV spark gap between the cathode and ground will limit the maximum clamp current (for this resistor value, the CRT has to be connected to the main printed-circuit board).
This external network causes an increase in the rise and fall times and a decrease in the overshoot. Pin 10 must be decoupled to pin 8: * By a capacitor >100 nF with good HF behaviour (e.g. foil). This capacitor must be placed as close as possible to pins 10 and 8; definitely within 5 mm. * By a capacitor >10 F on the picture tube base printed-circuit board (common for 3 output stages).
2000 Dec 13
10
Philips Semiconductors
Product specification
Video output amplifier
TEST AND APPLICATION INFORMATION Dissipation Regarding dissipation, distinction must be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). The static dissipation of the TDA6120Q is due to supply currents, and currents in the feedback network and CRT. The static dissipation is given by the following equation: P stat = V CC x I CC + V DD x I DD V OUTC - V OUTC x ----------------- - V OUTC x I OUTC Rf Where: Rf = feedback resistance IOUTC = DC cathode current. The dynamic dissipation is given by the following equation: Pdyn = VDD x (CL + Cint) x f x VOUTC(p-p) x b Where: CL = load capacitance
TDA6120Q
Cint = effective internal load capacitance (approximately 7 pF) f = frequency VOUTC(p-p) = output voltage (peak-to-peak value) b = non-blanking duty cycle (0.8). The IC must be mounted on the picture tube base printed-circuit board to minimize the load capacitance CL. Switch-off The TDA6120Q is equipped with a switch-off circuit to guarantee a controlled switch-off behaviour of the output pins. The switch-off function is activated when the low supply voltage (VCC) drops below a reference level (VCC(sw)). Then the voltage at output pins OUT and OUTC is pulled to the high supply voltage level (VDD), independant of input pin voltage levels.
2000 Dec 13
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Philips Semiconductors
Product specification
Video output amplifier
INTERNAL PIN CONFIGURATION
TDA6120Q
handbook, full pagewidth
VCC 6
VDD 10
VIN-
2 ESD ESD 12 ESD ESD
RC-
1
OUTC
TDA6120Q
VIN+ 4 ESD 3 ESD ESD ESD 13 OUT
RC+
IIN
5 ESD 7 ESD OUTM
8 GND
MGK439
Fig.8 Internal pin diagram.
2000 Dec 13
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Philips Semiconductors
Product specification
Video output amplifier
PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm)
TDA6120Q
SOT141-8
non-concave x D Dh
Eh
view B: mounting base side
d
A2
B j E A
L3 L Q 1 Z e e1 bp wM 13 m e2 c vM
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 3.4 e1 1.7 e2 5.08 Eh 6 j 3.4 3.1 L 8.4 7.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.6 w 0.25 x 0.03 Z (1) 2.00 1.45
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT141-8 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-12-16 99-12-17
2000 Dec 13
13
Philips Semiconductors
Product specification
Video output amplifier
SOLDERING Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Soldering by dipping or by solder wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds.
TDA6120Q
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. suitable suitable(1) WAVE
2000 Dec 13
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Philips Semiconductors
Product specification
Video output amplifier
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
TDA6120Q
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 Dec 13
15
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753504/04/pp16
Date of release: 2000
Dec 13
Document order number:
9397 750 07562

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